AM29LV640MH datasheet(13/62 Pages) AMD

13 / 62 page

December 14, 2005

Am29LV640MH/L

DA TA SH EET

Word/Byte Configuration

The BYTE# pin controls whether the device data I/O

pins operate in the byte or word configuration. If the

BYTE# pin is set at logic ‘1’, the device is in word con-

figuration, DQ0–DQ15 are active and controlled by

CE# and OE#.

If the BYTE# pin is set at logic ‘0’, the device is in byte

configuration, and only data I/O pins DQ0–DQ7 are

active and controlled by CE# and OE#. The data I/O

pins DQ8–DQ14 are tri-stated, and the DQ15 pin is

used as an input for the LSB (A-1) address function.

VersatileIO

™ (V

IO) Control

The VersatileIO™ (V

IO) control allows the host system

to set the voltage levels that the device generates and

tolerates on CE# and DQ I/Os to the same voltage

level that is asserted on VIO. See “Ordering Informa-

tion” on page 9 for VIO options on this device.

For example, a VI/O of 1.65–3.6 volts allows for I/O at

the 1.8 or 3 volt levels, driving and receiving signals to

and from other 1.8 or 3 V devices on the same data

bus.

Requirements for Reading Array Data

To read array data from the outputs, the system must

drive the CE# and OE# pins to VIL. CE# is the power

control and selects the device. OE# is the output con-

trol and gates array data to the output pins. WE#

should remain at VIH.

The internal state machine is set for reading array data

upon device power-up, or after a hardware reset. This

ensures that no spurious alteration of the memory

content occurs during the power transition. No com-

mand is necessary in this mode to obtain array data.

Standard microprocessor read cycles that assert valid

addresses on the device address inputs produce valid

data on the device data outputs. The device remains

enabled for read access until the command register

contents are altered.

See “Reading Array Data” for more information. Refer

to the AC Read-Only Operations table for timing speci-

fications and to Figure 14 for the timing diagram. Refer

to the DC Characteristics table for the active current

specification on reading array data.

Page Mode Read

The device is capable of fast page mode read and is

compatible with the page mode Mask ROM read oper-

ation. This mode provides faster read access speed

for random locations within a page. The page size of

the device is 4 words/8 bytes. The appropriate page is

selected by the higher address bits A(max)–A2. Ad-

dress bits A1–A0 in word mode (A1–A-1 in byte mode)

determine the specific word within a page. This is an

asynchronous operation; the microprocessor supplies

the specific word location.

The random or initial page access is equal to t

ACC or

CE and subsequent page read accesses (as long as

the locations specified by the microprocessor falls

within that page) is equivalent to t

PACC. When CE# is

deasserted and reasserted for a subsequent access,

the access time is t

ACC or tCE.

Fast page mode ac-

cesses are obtained by keeping the “read-page ad-

dresses” constant and changing the “intra-read page”

addresses.

Writing Commands/Command Sequences

To write a command or command sequence (which in-

cludes programming data to the device and erasing

sectors of memory), the system must drive WE# and

CE# to VIL, and OE# to VIH.

The device features an Unlock Bypass mode to facili-

tate faster programming. Once the device enters the

Unlock Bypass mode, only two write cycles are re-

quired to program a word or byte, instead of four. The

“Word/Byte Program Command Sequence” section

has details on programming data to the device using

both standard and Unlock Bypass command se-

quences.

An erase operation can erase one sector, multiple sec-

tors, or the entire device. Table 2 indicates the address

space that each sector occupies.

Refer to the DC Characteristics table for the active

current specification for the write mode. The AC Char-

acteristics section contains timing specification tables

and timing diagrams for write operations.

Write Buffer

Write Buffer Programming allows the system to write a

maximum of 16 words/32 bytes in one programming

operation. This results in faster effective programming

time than the standard programming algorithms. See

“Write Buffer” for more information.

Accelerated Program Operation

The device offers accelerated program operations

through the ACC function. This is one of two functions

provided by the WP#/ACC pin. This function is prima-

rily intended to allow faster manufacturing throughput

at the factory.

If the system asserts VHH on this pin, the device auto-

matically enters the aforementioned Unlock Bypass

mode, temporarily unprotects any protected sectors,

and uses the higher voltage on the pin to reduce the

time required for program operations. The system

would use a two-cycle program command sequence

as required by the Unlock Bypass mode. Removing

VHH from the WP#/ACC pin returns the device to nor-

mal operation. Note that the WP#/ACC pin must not be

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