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2005-2020 Microchip Technology Inc.

DS20005045D-page 28

SST25VF080B

2-IN

1-IN

0.65 BSC

BOTTOM VIEW

A1 CORNER

TOP VIEW

16-xfbga-ZC Z1 C-25VF080B-018

1mm

SIDE VIEW

SEATING PLANE

0.10 0 .015

0.40 max

0.35 nom

0.30 min

0.05

BA

2-OUT

1-OUT

2-IN

1-IN

2-OUT

1-OUT

D

C

B

A

INNER SECTION

VIEW

INNER SECTION

DETAIL

ø0.25

0. 03

(16X)

Note:

1. This specific package is not registered in JEDEC Publication 95.

2. All linear dimensions are in millimeters.

3.

recommends underfill for best solder joint reliability.

4. Top View body tolerance is 0.05 mm.

5. Coplanarity is 0.05 mm.

6. Ball width at interface to package body is 0.25 mm ( 0. 03 mm).

0.50 BSC

0.50

2.0

BSC BSC

A1 INDICATOR (engraved)

C

D

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note: