SW52212 datasheet(18/71 Pages) SILABS

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Table 4.5. Thermal Conditions

Parameter

Symbol

Test Condition

Value

Units

Si52202 - 20-QFN

Thermal Resistance, Junction to Ambient1

θJA

Still Air

Air Flow 1 m/s

Air Flow 2 m/s

54.4

°C/W

Thermal Resistance, Junction to Case1

θJC

10.8

°C/W

Thermal Resistance, Junction to Board1

θJB

34.1

°C/W

Thermal Resistance, Junction to Top Center1

ΨJT

3.1

°C/W

Thermal Resistance, Junction to Board1

ΨJB

33.9

°C/W

Si52204 - 32-QFN

Thermal Resistance, Junction to Ambient2

θJA

Still Air

Air Flow 1 m/s

Air Flow 2 m/s

50.3

45.6

°C/W

Thermal Resistance, Junction to Case2

θJC

10.3

°C/W

Thermal Resistance, Junction to Board2

θJB

30.9

°C/W

Thermal Resistance, Junction to Top Center2

ΨJT

2.3

°C/W

Thermal Resistance, Junction to Board2

ΨJB

30.9

°C/W

Si52208 - 48-QFN

Thermal Resistance, Junction to Ambient3

θJA

Still Air

Air Flow 1 m/s

Air Flow 2 m/s

27.9

24.5

23.5

°C/W

Thermal Resistance, Junction to Case3

θJC

°C/W

Thermal Resistance, Junction to Board3

θJB

13.4

°C/W

Thermal Resistance, Junction to Top Center3

ΨJT

0.5

°C/W

Thermal Resistance, Junction to Board3

ΨJB

13.1

°C/W

Si52212 - 64-QFN

Thermal Resistance, Junction to Ambient4

θJA

Still Air

Air Flow 1 m/s

Air Flow 2 m/s

27.2

23.9

22.5

°C/W

Thermal Resistance, Junction to Case4

θJC

13.7

°C/W

Thermal Resistance, Junction to Board4

θJB

14.4

°C/W

Thermal Resistance, Junction to Top Center4

ΨJT

0.5

°C/W

Thermal Resistance, Junction to Board4

ΨJB

14.2

°C/W

Data Sheet

Electrical Specifications

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