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TC35679FSG датащи(PDF) 14 Page - Toshiba Semiconductor

номер детали TC35679FSG
подробное описание детали  TC35679FSG-002 Bluetooth® low energy IC
PDF  45 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
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TC35679FSG датащи(HTML) 14 Page - Toshiba Semiconductor

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TC35679FSG-002
2018-01-17
14
4.1.2.
Support Protocol Layer
Following figure shows the Bluetooth Protocol and Profile Layer supported.
It has RF control, Link layer, internal HCI, L2CAP, ATT, SMP and GATT.
Figure 4-1 Protocol Layer
4.1.3.
RF
Since the RF analog part of TC35679 builds in not only transmission and reception circuits but also the RF switch and the matching
circuit, the RFIO pin which is a single I/O does not need an external matching circuit. The wireless device which suits for RF-PHY
specifications of Bluetooth low energy can be realized easily by connecting to 50 Ω wiring.
The transmission power can be selected from intended power between 0 and -20 dBm (4 dB steps). Not only default transmission
power but also transmission power to the specified destination can be set. The RSSI of reception block has an accuracy of ± 2 dB
(typ.) to the input signal between -90 and -10 dBm.
4.1.4.
Auto Advertise Function
Using an auto advertise function enables repeating transmissions of advertise packets with very small power. The auto advertise
function is a function which transmits intended advertise packets without waking CPU up in Backup mode. Then, a scan request
and a connection request can be also received. The response to the remote device can be preset in case of receiving a scan
request, and when one connection request is received, this function wakes CPU up and leaves a subsequent process to the user
software.
CommandAPI
Option: User-Application (User-App)
Service Database
GATT
ATT
SMP
Connection
Update
GAP
UART Driver
L2CAP
Internal HCI
Link layer
RF control



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