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LT8607 датащи(PDF) 15 Page - Analog Devices

номер детали LT8607
подробное описание детали  Industrial SPoE PD Controller
PDF  20 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
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LT8607 датащи(HTML) 15 Page - Analog Devices

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LTC9111
15
Rev. 0
For more information www.analog.com
The low-side polarity correcting MOSFETs should be sized
appropriately for the current level of the application. The
drive voltage at the LGATE1 and LGATE2 pins is compat-
ible with modern standard-level power MOSFETs. These
MOSFETs do not experience high voltage and high current
simultaneously, so SOA performance is not critical.
REMOTE SENSE PINS
The SNS1 and SNS2 pins allow the LTC9111 to sense
the port voltage outside the power rectifier for SCCP and
accurate state machine voltage thresholds.
For most applications, the pins can be connected on the
application side of the power coupling network. This pre-
vents parasitic capacitance from corrupting the data sig-
nal and filters out excessive ringing that can be observed
directly at the connector during classification. A small
snubber between the SNS pins (C3/R2, Figure 9) pre-
vents high-frequency ringing when the rectifying diodes
are reverse biased during SCCP logic transitions.
SCCP PULL-DOWN MOSFET
The LTC9111 uses external MOSFETs (M2/M3, Figure 9)
to pull-down the port voltage during classification in
order to transmit a logic low. The use of two external
MOSFETs allows successful classification regardless of
input connector polarity configuration. The drive voltage
at the SCCP pin is appropriate for low cost, logic-level
discrete MOSFETs.
While inexpensive, commodity external MOSFETs such as
the BSS123 will generally suffice for this purpose, some
care may be needed to ensure that the IEEE 802.3cg stan-
dard requirements are met while protecting the compo-
nents from overstress.
IEEE 802.3cg requires that a PD sink 30mA with a connec-
tor voltage of 0.8V while signaling a logic low. The SCCP
pull-down must be connected in series with the power
coupling network magnetics to prevent corruption of the
data link by parasitic capacitances. As such, the voltage
developed over the parasitic resistance of the coupling
network must be included when calculating the effective
pull-down strength.
Depending on the coupling network resistance and induc-
tance, the peak transient current through the pull-down
MOSFET may exceed the absolute maximum rating of
some low-cost external MOSFETs. A resistor in series with
the source of the SCCP pull-down can be used to reduce
the peak current, provided it does not compromise the
effective DC pull-down strength.
To meet the 0.8V/30mA requirement, the total SCCP
pull-down path resistance needs to be less than 26.6Ω.
This resistance includes the coupling network parasitic
resistance, MOSFET RDS(ON), and any limiting resistors.
Variations in the external MOSFET parameters should
be accounted for when selecting an appropriate discrete
MOSFET.
PD LOAD DYNAMICS
In order to protect PHY data integrity and avoid EMI
issues, IEEE 802.3cg establishes specific limitations for
input current dI/dt, input voltage dV/dt, and ripple voltage
amplitude measured at the PI. The coupling network and
PD capacitance form a filter between the application and
the connector, so that AC dynamics in the application are
attenuated at the connector. Additional filtering elements
may be required in applications with large dynamic loads.
Filtering can be achieved with bulk capacitance at the
hot swap output, a higher-order series filter network, or
capacitance at the output of a step-down converter ser-
vicing the application load, as shown in Figure 10.
In addition to filtering high frequency noise generated by,
for example, switching in the application circuitry, these
elements play an important role in case of large transient
load steps. Because of the large inductors in the power
coupling network, the current provided by the PSE can-
not change instantaneously. The application must have
enough bulk capacitance to prevent the line voltage from
browning out during a load step.
The optimal configuration of these filtering elements
depends on the specific application—how much high-fre-
quency noise it generates, and the magnitude and speed
of the worst-case change in load during operation.
APPLICATIONS INFORMATION



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