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LT8607 датащи(PDF) 6 Page - Analog Devices

номер детали LT8607
подробное описание детали  Industrial SPoE PD Controller
PDF  20 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
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LTC9111
6
Rev. 0
For more information www.analog.com
PIN FUNCTIONS
SNS1 (Pin 1): PD Power Interface Sense Input 1. Connect
to MDI/PI connector pin 1 through the coupling network.
See Applications Information for more details.
SNS2 (Pin 2): PD Power Interface Sense Input 2. Connect
to MDI/PI connector pin 2 through the coupling network.
See Applications Information for more details.
IN (Pin 3): Controller Supply Voltage.
STBY (Pin 4): 3.5V Low-Dropout (LDO) Regulator Output.
Bypass with a 2.2µF ceramic capacitor close to the pin.
CLASSV (Pin 5): Binary PD Class Voltage Configuration
Input. Tie to GND for 24V Classes (Class 10 through 12).
Tie to STBY for 55V Classes (Class 13 through 15).
EN (Pin 6): Digital Enable Output. Asserts high when the
port is powered on and the external hot swap MOSFET is
enhanced. Connect to enable input of the PD application
DC/DC converter(s).
SCCP (Pin 7): SCCP Pull-Down Gate Drive. Connect to
gate of external pull-down N-channel MOSFETs for trans-
mitting a logic 0 during classification. See Applications
Information for more details.
LGATE2 (Pin 8): Low-Side Active Bridge Gate Drive 2.
Connect to gate of low-side pass MOSFET connected to
MDI/PI connector pin 2.
LGATE1 (Pin 9): Low-side Active Bridge Gate Drive 1.
Connect to gate of low-side pass MOSFET connected to
MDI/PI connector pin 1.
CLASSC (Pin 10): Ternary PD Class Current Configuration
Input. Together with CLASSV pin, CLASSC pin can be tied
HIGH, LOW or left unconnected to configure the LTC9111
as PD Class 10 through 15 as defined by IEEE 802.3cg.
See Class Configuration section for more information.
OUT (Pin 11): PD Supply Voltage Output. For inrush con-
trol, connect to source of external N-channel MOSFET.
GATE (Pin 12): Gate Drive External N-Channel MOSFET.
Capacitance to GND determines inrush time.
GND(Pin 13): Exposed Pad and Device Ground. Must be
soldered to PCB ground.
(DFN, MSOP)



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