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AD8384ASVZ датащи(PDF) 20 Page - Analog Devices

номер детали AD8384ASVZ
подробное описание детали  10-Bit, 6-Channel Decimating LCD DecDriver-R with Level Shifters
PDF  24 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD8384ASVZ датащи(HTML) 20 Page - Analog Devices

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AD8384
Rev. 0 | Page 20 of 24
AD8384 PCB DESIGN RECOMMENDATIONS
Top PCB Layer
Land Pattern Dimensions
Pad Size:
0.6 mm × 0.25 mm
Pad Pitch:
0.5 mm
Thermal Pad Size:
6 mm × 6 mm
Thermal via structure:
0.25 mm to 0.35 mm diameter via holes on
a 0.5 mm to 1.0 mm grid.
14 mm
LAND PATTERN – TOP LAYER
6 mm
Figure 21. Land Pattern—Top Layer
Bottom PCB Layer
Thermal Pad and Thermal Via Connections
The thermal pad on the solder side is connected to a plane. Use of
thermal spokes is not recommended when connecting the thermal
pads or via structure to the plane.
LAND PATTERN – BOTTOM LAYER
6 mm
Figure 22. Land Pattern—Bottom Layer
Solder Masking
Solder masking of the via holes on the top layer of the PCB plugs
the via holes, inhibiting solder flow into the holes. To minimize the
formation of solder voids due to solder flowing into the via holes
(solder wicking), the via diameter should be made small and an
optional solder mask may be used. To optimize thermal pad
coverage, the solder mask’s diameter should be no more than
0.1 mm larger than the via hole diameter.
Solder Mask—Top Layer
Pads:
Set by the customer’s PCB design rules.
Thermal Via Holes:
Circular mask, centered on the via holes.
Diameter of the mask should be 0.1 mm larger than the via hole
diameter.
Solder Mask—Bottom Layer
Set by customer’s PCB design rules.
SOLDER MASK – TOP LAYER
Figure 23. Solder Mask—Top Layer



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