AD8384

Rev. 0 | Page 8 of 24

ABSOLUTE MAXIMUM RATINGS

Table 6. AD8384 Stress Ratings9

Parameter

Rating

Supply Voltages

AVCCx – AGNDx

18 V

DVCC – DGND

4.5 V

Input Voltages

Maximum Digital Input Voltage

DVCC + 0.5 V

Minimum Digital Input Voltage

DGND – 0.5 V

Maximum Analog Input Voltage

AVCC + 0.5 V

Minimum Analog Input Voltages

AGND – 0.5 V

Internal Power Dissipation10

4.16 W

Operating Temperature Range

0°C to 85°C

Storage Temperature Range

–65°C to +125°C

Lead Temperature Range (Soldering 10 sec)

300°C

permanent damage to the device. This is a stress rating only; functional

operation of the device at these or any other conditions above those

indicated in the operational section of this specification is not implied.

Exposure to the absolute maximum ratings for extended periods may

reduce device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8384 is limited by its junction temperature. The maximum

safe junction temperature for plastic encapsulated devices, as

determined by the glass transition temperature of the plastic, is

approximately 150°C. Exceeding this limit temporarily may

cause a shift in the parametric performance due to a change in

the stresses exerted on the die by the package. Exceeding a

junction temperature of 175°C for an extended period can

result in device failure.

OPERATING TEMPERATURE RANGE

Although the maximum safe operating junction temperature is

higher, the AD8384 is 100% tested at a junction temperature of

125°C. Consequently, the maximum guaranteed operating

junction temperature is 125°C.

To ensure operation within the specified temperature range, it is

necessary to limit the maximum power dissipation as follows:

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OVERLOAD PROTECTION

The AD8384 employs a 2-stage overload protection circuit that

consists of an output current limiter and a thermal shutdown.

The maximum current at any one output of the AD8384 is, on

average, internally limited to 100 mA. In the event of a momen-

tary short circuit between a video output and a power supply

rail (VCC or AGND), the output current limit is sufficiently low

to provide temporary protection.

The thermal shutdown debiases the output amplifier when the

junction temperature reaches the internally set trip point. In the

event of an extended short-circuit between a video output and a

power supply rail, the output amplifier current continues to

switch between 0 mA and 100 mA typical with a period deter-

mined by the thermal time constant and the hysteresis of the

thermal trip point. Thermal shutdown provides long term pro-

tection by limiting average junction temperature to a safe level.

EXPOSED PADDLE

To ensure optimized thermal performance, the exposed paddle

must be thermally connected to an external plane, such as

AVCC or GND, as described in the Application Notes.

1.0

2.0

1.5

2.5

85

80

70

75

65

90

95

100

105

AMBIENT TEMPERATURE (°C)

100MHz

60Hz XGA

QUIESCENT

STILL AIR

200lfm

500lfm

Figure 2. Maximum Power Dissipation vs. Temperature*

*AD8384 on a 4-layer JEDEC PCB with thermally optimized landing pattern, as

described in the Application Notes.

Note:

When operating under the conditions specified in this

data sheet, the AD8384’s quiescent power dissipation is 1.1 W.

When driving a 6-channel XGA panel with a 150 pF input

capacitance, the AD8384 dissipates a total of 1.58 W when

displaying 1-pixel-wide alternating white and black vertical

lines generated by a standard 60 Hz XGA input video. When the

pixel clock frequency is raised to 100 MHz (the AD8384’s

maximum specified operating frequency), total power

dissipation increases to 1.83 W. Figure 2 shows these specific

power dissipations.