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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32G0 датащи(PDF) 108 Page - STMicroelectronics |
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STM32G0 датащи(HTML) 108 Page - STMicroelectronics |
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108 / 135 page  Package information STM32G071x8/xB 108/135 DS12232 Rev 4 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 WLCSP25 package information WLCSP25 is a 25-ball, 2.30 x 2.48 mm wafer-level chip-scale package with 0.4 mm pitch. Figure 32. WLCSP25 chip-scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. A06J_WLCSP25_ME_V1 Z A B C D E 21 3 4 5 G e e e2 e1 F A1 ball location D E aaa (4X) BOTTOM VIEW TOP VIEW A A2 A1 bbb Z DETAIL A A3 A2 b FRONT VIEW SIDE VIEW DETAIL A ROTATED 90 BUMP eee Z b (25x) ccc Z Y X ddd Z M M A1 |
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