AD4134 datasheet(13/92 Pages) AD

13 / 92 page

Data Sheet

AD4134

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 13 of 92

Table 6.

Parameter

Rating

AVDD5 to AGND5

−0.3 V to +6 V

DVDD5 to DGND5

−0.3 V to +6 V

AVDD1V8 to AGND1V8

−0.3 V to 2.2 V or LDOIN + 0.3 V

(whichever is lower)

DVDD1V8 to DGND1V8

−0.3 V to 2.2 V or LDOIN + 0.3 V

(whichever is lower)

CLKVDD to CLKGND

−0.3 V to 2.2 V or LDOIN + 0.3 V

(whichever is lower)

IOVDD to IOGND

−0.3 V to +2.2 V

DGND5 to AGND5

−0.3 V to +0.3 V

AGND1V8 to AGND5

−0.3 V to +0.3 V

DGND1V8 to AGND5

−0.3 V to +0.3 V

IOGND to AGND5

−0.3 V to +0.3 V

CLKGND to AGND5

−0.3 V to +0.3 V

LDOIN to AGND5

AVDD1V8 − 0.3 V to 6 V

AINx± Inputs to AGND5

−1 V to AVDD5 + 0.3 V

REFIN to AGND5

−0.3 V to AVDD5 + 0.3 V

REFCAP to AGND5

−0.3 V to AVDD5 + 0.3 V

REFGND to AGND5

−0.3 V to +0.3 V

Digital I/O Pins to IOGND

−0.3 V to IOVDD + 0.3 V

XCLKOUT, XTAL2/CLKIN, and XTAL1 to

CLKGND

−0.3 V to CLKVDD + 0.3 V

Operating Ambient Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Pb-Free Temperature, Soldering Reflow

(10 sec to 30 sec)

260°C

Junction Temperature

150°C

Package Classification Temperature

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only, functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-56-9

2S2P or 1S Test Board

371

5.42

°C/W

2S2P Test Board with 36 Thermal Vias

273

N/A4

°C/W

1 Simulated data based on a JEDEC 2S2P test board in a JEDEC natural

convection environment.

2 Simulated data based on a JEDEC 1S test board, measured at the exposed

pad with a cold plate mounted directly to the package surface.

3 Simulated data based on a JEDEC 2S2P test board with 36 thermal vias in a

JEDEC natural convection environment.

4 N/A means not applicable.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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