Illumination

Direction

Off-state

Light

TP1

Window Edge

(4 surfaces)

TP1

TP5

TP5

TP4

TP4

TP2

TP3 (TP2)

TP3

12.70

2.00

2X 12.89

2X 5.50

25

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Optical Interface and System Image Quality Considerations (continued)

7.5.1.3 Illumination Overfill

The active area of the device is surrounded by an aperture on the inside DMD window surface that masks

structures of the DMD chip assembly from normal view, and is sized to anticipate several optical operating

conditions. Overfill light illuminating the window aperture can create artifacts from the edge of the window

aperture opening and other surface anomalies that may be visible on the screen. The illumination optical system

should be designed to limit light flux incident anywhere on the window aperture from exceeding approximately

10% of the average flux level in the active area. Depending on the particular system’s optical architecture, overfill

light may have to be further reduced below the suggested 10% level in order to be acceptable.

7.6 Micromirror Array Temperature Calculation

Figure 18. DMD Thermal Test Points

Micromirror array temperature can be computed analytically from measurement points on the outside of the

package, the ceramic package thermal resistance, the electrical power dissipation, and the illumination heat load.

The relationship between micromirror array temperature and the reference ceramic temperature is provided by

the following equations:

(1)

(2)

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Thermal Information

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