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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD9675KBCZ датащи(PDF) 61 Page - Analog Devices |
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AD9675KBCZ датащи(HTML) 61 Page - Analog Devices |
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61 / 61 page  AD9675 Data Sheet Rev. A | Page 60 of 60 OUTLINE DIMENSIONS Figure 62. 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA] (BC-144-1) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD9675KBCZ 0°C to 85°C 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA] BC-144-1 AD9671EBZ Evaluation Board 1 Z = RoHS Compliant Part. *COMPLIANT WITH JEDEC STANDARDS MO-275-EEAB-1 WITH EXCEPTION TO PACKAGE HEIGHT. 0.80 0.60 REF A B C D E F G 9 10 8 11 12 7 5 64 2 31 BOTTOM VIEW 8.80 BSC SQ H J K L M DETAIL A TOP VIEW DETAIL A COPLANARITY 0.20 0.50 0.45 0.40 *1.40 MAX BALL DIAMETER SEATING PLANE 10.10 10.00 SQ 9.90 A1 BALL CORNER A1 BALL CORNER 0.25 MIN 0.65 MIN ©2013–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11381-0-1/16(A) |
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