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STM32L062T8 датащи(PDF) 99 Page - STMicroelectronics |
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STM32L062T8 датащи(HTML) 99 Page - STMicroelectronics |
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99 / 118 page ![]() DocID025937 Rev 8 99/118 STM32L062x8 Package information 112 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at www.st.com. ECOPACK® is an ST trademark. 7.1 Standard WLCSP36 package information Figure 32. Standard WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z |
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