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STM32L062T8 датащи(PDF) 50 Page - STMicroelectronics |
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STM32L062T8 датащи(HTML) 50 Page - STMicroelectronics |
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50 / 118 page ![]() Electrical characteristics STM32L062x8 50/118 DocID025937 Rev 8 6.3 Operating conditions 6.3.1 General operating conditions Table 21. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency - 0 32 MHz fPCLK1 Internal APB1 clock frequency - 0 32 fPCLK2 Internal APB2 clock frequency - 0 32 VDD Standard operating voltage BOR detector disabled 1.65 3.6 V BOR detector enabled, at power-on 1.8 3.6 BOR detector disabled, after power-on 1.65 3.6 VDDA Analog operating voltage (DAC not used) Must be the same voltage as VDD(1) 1.65 3.6 V VDDA Analog operating voltage (all features) Must be the same voltage as VDD(1) 1.8 3.6 V VIN Input voltage on FT, FTf and RST pins(2) 2.0 V ≤VDD ≤3.6 V -0.3 5.5 V 1.65 V ≤VDD ≤2.0 V -0.3 5.2 Input voltage on BOOT0 pin - 0 5.5 Input voltage on TC pin - -0.3 VDD+0.3 PD Power dissipation at TA = 85 °C (range 6) or TA =105 °C (rage 7) (3) Standard WLCSP36 - 318 mW Thin WLCSP36 - 338 LQFP32 - 351 UFQFPN32 - 526 Power dissipation at TA = 125 °C (range 3) (3) StandardWLCSP36 - 79 Thin WLCSP36 - 84 LQFP32 - 88 UFQFPN32 - 132 TA Temperature range Maximum power dissipation (range 6) –40 85 °C Maximum power dissipation (range 7) –40 105 Maximum power dissipation (range 3) –40 125 TJ Junction temperature range (range 6) -40 °C ≤TA ≤85 ° –40 105 Junction temperature range (range 7) -40 °C ≤TA ≤105 °C –40 125 Junction temperature range (range 3) -40 °C ≤TA ≤125 °C –40 130 1. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA can be tolerated during power-up and normal operation. 2. To sustain a voltage higher than VDD+0.3V, the internal pull-up/pull-down resistors must be disabled. 3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 78: Thermal characteristics on page 110). |
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