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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L062T8 датащи(PDF) 103 Page - STMicroelectronics |
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STM32L062T8 датащи(HTML) 103 Page - STMicroelectronics |
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103 / 118 page  DocID025937 Rev 8 103/118 STM32L062x8 Package information 112 Figure 35. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 74. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 3rd decimal place. Min Typ Max Min Typ Max A - - 0.33 - - 0.013 A1 - 0.10 - - 0.004 - A2 - 0.20 - - 0.008 - A3 - 0.025(2) 2. Back side coating. Nominal dimension rounded to the 3rd decimal place results from process capability. -- 0.001 - b 0.16 0.19 0.22 0.006 0.007 0.009 D 2.59 2.61 2.63 0.102 0.103 0.104 E 2.86 2.88 2.90 0.112 0.113 0.114 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - F - 0.305(3) 3. Calculated dimensions are rounded to 3rd decimal place. -- 0.012 - G - 0.440(3) -- 0.017 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 |
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