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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STA333IS датащи(PDF) 39 Page - STMicroelectronics |
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STA333IS датащи(HTML) 39 Page - STMicroelectronics |
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39 / 43 page  DocID022855 Rev 3 39/43 STA333IS Package mechanical data 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. The STA333IS comes in a CSP 5x6 array package. Soldering information Figure 12. Recommended soldering reflow profile for mounting on PCB Table 47. Recommended soldering reflow values for mounting on PCB Profile Typ. Max. Temp. gradient in preheat (T = 70 - 180 °C) 0.9 °C/s 3 °C/s Temp. gradient (T = 200 - 225 °C) 2 °C/s 3 °C/s Peak temp. in reflow 240 - 245 °C 260 °C Time above 220 °C 60 s 90 s Temp. gradient in cooling -2 to -3 °C -6 °C Time from 50 to 220 °C 160 to 220 s |
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