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STM32F031X4 датащи(PDF) 41 Page - STMicroelectronics

номер детали STM32F031X4
подробное описание детали  ARM-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V
PDF  106 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F031X4 датащи(HTML) 41 Page - STMicroelectronics

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STM32F031x4 STM32F031x6
Electrical characteristics
80
6.3
Operating conditions
6.3.1
General operating conditions
Table 18. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
48
MHz
fPCLK
Internal APB clock frequency
-
0
48
VDD
Standard operating voltage
-
2.0
3.6
V
VDDA
Analog operating voltage
(ADC not used)
Must have a potential equal
to or higher than VDD
VDD
3.6
V
Analog operating voltage
(ADC used)
2.4
3.6
VBAT
Backup operating voltage
-
1.65
3.6
V
VIN
I/O input voltage
TC and RST I/O
–0.3
VDDIOx+0.3
V
TTa I/O
–0.3
VDDA+0.3(1)
FT and FTf I/O
–0.3
5.5(1)
BOOT0
0
5.5
PD
Power dissipation at TA = 85 °C
for suffix 6 or TA = 105 °C for
suffix 7(2)
LQFP48
-
364
mW
UFQFPN32
-
526
LQFP32
-
357
UFQFPN28
-
169
WLCSP25
-
267
TSSOP20
-
182
TA
Ambient temperature for the
suffix 6 version
Maximum power dissipation
–40
85
°C
Low power dissipation(3)
–40
105
Ambient temperature for the
suffix 7 version
Maximum power dissipation
–40
105
°C
Low power dissipation(3)
–40
125
TJ
Junction temperature range
Suffix 6 version
–40
105
°C
Suffix 7 version
–40
125
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.7: Thermal characteristics.
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.7:
Thermal characteristics).



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