STM32F031X4 datasheet(87/106 Pages) STMICROELECTRONICS

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STM32F031X4 датащи(PDF) 87 Page - STMicroelectronics

номер детали	STM32F031X4

подробное описание детали	ARM-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V

PDF	106 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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87 / 106 page

DocID025743 Rev 4

87/106

STM32F031x4 STM32F031x6

Package information

102

Figure 37. UFQFPN32 package outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device

ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.

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