MCP3913 datasheet(27/82 Pages) MICROCHIP

27 / 82 page

 2013 Microchip Technology Inc.

DS20005227A-page 27

MCP3913

When an ADC exits ADC Shutdown mode, any phase

delay present before shutdown was entered will still be

present. If one ADC was not in Shutdown, the ADC

leaving Shutdown mode will automatically resynchro-

nize the phase delay relative to the other ADC channel

per the phase delay register block, and give data ready

pulses accordingly.

If an ADC is placed in Shutdown mode while others are

converting, it is not shutting down the internal clock.

When coming back out of Shutdown mode, it will

automatically be resynchronized with the clock that did

not stop during reset.

If all ADCs are in ADC Shutdown mode, the clock is not

distributed to the input structure or to the digital core for

low-power operation. This can potentially cause high

analog input leakage currents at the analog inputs, if

the input voltage is highly negative (typically below -

0.6V referred to AGND). Once either of the ADCs is

back to normal operation, the clock is automatically

distributed again.

4.22

Full Shutdown Mode

The lowest power consumption can be achieved when

SHUTDOWN<5:0> = 111111,

VREFEXT = CLKEXT = 1. This mode is called Full

Shutdown mode, and no analog circuitry is enabled. In

this mode, both AVDD and DVDD POR monitoring are

also disabled, and no clock is propagated throughout

the chip. All ADCs are in Shutdown mode, and the

internal voltage reference is disabled. This mode does

not reset the writable part of the register map to its

default values.

The clock is no longer distributed to the input structure

as well. This can potentially cause high analog input

leakage currents at the analog inputs, if the input volt-

age is highly negative (typically below -0.6V referred to

AGND).

The only circuit that remains active is the SPI interface,

but this circuit does not induce any static power

consumption. If SCK is idle, the only current

consumption comes from the leakage currents induced

by the transistors and is less than 5 µA on each power

supply.

This mode can be used to power down the chip

completely and avoid power consumption when there

is no data to convert at the analog inputs. Any SCK or

MCLK edge occurring while in this mode will induce

dynamic power consumption.

Once any of the SHUTDOWN<5:0>, CLKEXT and

VREFEXT bits return to ‘0’, the two POR monitoring

blocks are operational and AVDD and DVDD monitoring

can take place.

4.23

Measurement Error

The measurement error specification is typically used

in power meter applications. This specification is a

measurement of the linearity of the active energy of a

given power meter across its dynamic range.

For this measurement, the goal is to measure the

active energy of one phase when the voltage Root

Mean Square (RMS) value is fixed, and the current

RMS value is sweeping across the dynamic range

specified by the meter. The measurement error is the

non-linearity error of the energy power across the

current dynamic range. It is expressed in percent (%).

Equation 4-13 shows the formula that calculates the

measurement error:

EQUATION 4-13:

In the present device, the calculation of the active

energy is done externally, as a post-processing step

that

typically

happens

the

microcontroller,

considering, for example, the even channels as current

channels and the odd channels as voltage channels.

The odd channels (voltages) are fed with a full-scale

sine wave at 600 mV peak, and are configured with

GAIN = 1 and DITHER = Maximum. To obtain the

active energy measurement error graphs, the even

channels are fed with sine waves with amplitudes that

vary from 600 mV peak to 60 µV peak, representing a

10000:1 dynamic range. The offset is removed on both

current and voltage channels, and the channels are

multiplied together to give instantaneous power. The

active energy is calculated by multiplying the current

and voltage channel, and averaging the results of this

power during 20 seconds, to extract the active energy.

The sampling frequency is chosen as a multiple integer

of line frequency (coherent sampling). Therefore, the

calculation does not take into account any residue

coming from bad synchronization.

The measurement error is a function of IRMS and varies

with the OSR, averaging time, MCLK frequency and is

tightly

coupled

with

the

noise

and

linearity

specifications. The measurement error is a function of

the linearity and THD of the ADCs, while the standard

deviation of the measurement error is a function of the

noise specification of the ADCs. Overall, the low THD

specification enables low measurement error on a very

large dynamic range (e.g. 10,000:1). A low noise and

high SNR specification enables the decreasing of the

measurement time and, therefore, the calibration time,

to obtain a reliable measurement error specification.

Figure 2-5 shows the typical measurement error

curves obtained with the samples acquired by the

MCP3913, using the default settings with a 1-point and

2-point calibration. These calibrations are detailed in

Section 7.0

“Basic

Application

Recommenda-

tions”

Measurement Error I

RMS

 Measured Active Energy Active Energy present at inputs

–

Active Energy present at inputs

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