KAF−8300

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24

MECHANICAL INFORMATION

Visual Mechanical Specifications

Table 16. LASER MARK

Item

Description

Device Name

KAF−8300CE, KAF−8300XE, KAF−8300−AXC (Multiple versions available).

See Ordering Information section of this document.

Serial Number

nnn −a numeric field containing a maximum of three characters denoting a unique unit identifier for a device

from the before mentioned production lot. The start of the sequence starts with “1”. “001” is not a valid

marking.

NOTE: All markings shall be readable, consistent in size with no unusual debris left on the package.

Table 17. ASSEMBLY/PACKAGE INTEGRITY

Criteria

Description

Cracks

None allowed.

Corner and Edge

Chip-Outs

None − exceeding 0.020

″ (0.50 mm).

Chip-Outs Exposing

Buried Metal Traces

None allowed.

Chip-Outs, Other

None allowed deeper than 50% of the ceramic layer thickness in which it resides.

Scratches

None − that exceed 0.020

″ (0.50 mm) in the major dimension and are deeper than 50% of the ceramic layer

thickness in which it resides.

Lead Conditions

No bent, missing, damaged, or short leads. No lead cut-off burrs exceeding 0.005

″ (0.13 mm) in the

dimension away from the lead.

Internal Appearance

and Die Condition

Local Non-Uniformity: Local Non-Uniformity region (LNU) is allowed whose size is not greater than 200

within the effective image area. Inspection equipment for these steps are performed using a microscope

7−50X and direct lighting (ring-light). LNU is described as a spot or streak that tends to change from light to

dark in appearance as the operator rotates the part under angled lighting conditions. These non-uniformities

are not visible or very hard to see under direct lighting. They tend to disappear or become much less visible

under higher magnification.

Conditions Other than LNU: No scratches, digs, contamination, marks, or blemishes that is attached to the

die that touches 9 or more pixels in the effective image area. No loose contamination allowed when viewed

at 7X and 50X magnification. No scratches, digs, contamination, marks, or blemishes greater than 10

mm are

allowed on the bottom side of the cover glass region that is contained in or extends into the effective image

area. Tools used to verify are 7X and 50X magnification.

Table 18. GLASS

Criteria

Description

Tilt

The reject condition is when the glass is incorrectly seated on the package or is not parallel to glass seal

area. (“parallel” is defined as 0.25 mm maximum end to end).

Seal

Glass seal must be greater than 50% of the width of the epoxy bond line and must not extend over the

ceramic package.

Alignment

There are 4 “+” fiducials on the corners the die that must not be covered by the epoxy light shield.

The 4 “+” marks must be in total view when the lid is placed looking directly down on the device with

a microscope. All 4 “+” alignment marks are required to be visible in their entirety with a zero clearance

tolerance.

Chips

None allowed.

Appearance

No fogged cover allowed.

Contamination

No immobile scratches, digs, contamination, marks, or blemishes are allowed on the cover glass region that

is contained in or extends into the effective image area. Within the effective image area, the limit for such

conditions is 10

mm or less. This criterion pertains to either the top or the bottom glass surface. Tools used to

verify are 7X and 50X magnification.