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KAF-8300 датащи(PDF) 18 Page - ON Semiconductor |
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KAF-8300 датащи(HTML) 18 Page - ON Semiconductor |
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18 / 28 page ![]() KAF−8300 www.onsemi.com 18 TIMING Table 14. REQUIREMENTS AND CHARACTERISTICS Description Symbol Minimum Nominal Maximum Unit Notes H1, H2 Clock Frequency fH − − 28 MHz 1, 2 V1, V2 Clock Frequency fV − − 125 kHz 2 Pixel Period (1 Count) te 35.7 − − ns 2 H1, H2 Set-up Time tHS 1 − − ms H1L−VOUT Delay tHV 0 3 − ns RG−VOUT Delay tRV 0 1 − ns Readout Time tREADOUT 340.2 − − ms 4, 5 Integration Time tINT − − − 3, 4 Line Time tLINE 132.2 − − ms 4 Flush Time tFLUSH 21.23 − − ms 6 1. 50% duty cycle values. 2. CTE will degrade above the nominal frequency. 3. Integration time is user specified. 4. Longer times will degrade noise performance. 5. tREADOUT = tLINE ⋅ 2574 lines. 6. See Figure 19 for a detailed description. Table 15. CLOCK SWITCHING CHARACTERISTICS Description Symbol Min. Nom. Max. Unit Notes V1 Rise Time tV1r − 0.26 1 ms 3 V2 Rise Time tV2r − 0.55 1 ms 3 V1 Fall Time tV1f − 0.43 1 ms 3 V2 Fall Time tV2f − 0.31 1 ms 3 V1 Pulse Width tV1w 5.0 − − ms 4, 5 V2 Pulse Width tV2w 3.0 − − ms 4, 5 H1 Rise Time tH1r − 9.0 10 ns 3 H2 Rise Time tH2r − 6.9 10 ns 3 H1 Fall Time tH1f − 5.8 10 ns 3 H2 Fall Time tH2r − 5.4 10 ns 3 H1−H2 Pulse Width tH1w, tH2w 14 18 22 ns H1L Rise Time tH1Lr − 1.8 4 ns 3 H1L Fall Time tH1Lf − 2.5 4 ns 3 H1L Pulse Width tH1Lw 14 19 22 ns RG Rise Time tRGr − 2.0 4 ns 3 RG Fall Time tRGf − 2.2 4 ns 3 RG Pulse Width tRGw − 6.7 − ns 2 1. H1, H2 clock frequency: 28 MHz. The maximum and minimum values in this table are supplied for reference. The actual clock timing was measured using the KAF−8300 Evaluation Board. Testing against the device performance specifications is performed using the nominal values. 2. RG should be clocked continuously. 3. Relative to the pulse width (based on 50% of high/low levels). 4. CTE 5. Longer times will degrade noise performance. |
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