L6717 datasheet(12/56 Pages) STMICROELECTRONICS

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Pins description and connection diagrams

L6717

12/56

Doc ID 17326 Rev 1

PWRGOOD

VCORE and NB Power Good.

It is an open-drain output set free after SS as long as both the voltage planes are

within specifications. Pull-up to 3.3V (typ) or lower, if not used it can be left floating.

When in PVI mode, it monitors the CORE section only.

NB_BOOT

NB section high-side driver supply.

This pin supplies the high-side floating driver. Connect through CBOOT capacitor to the

NB_PHASE pin.

See Section 10 for guidance in designing the capacitor value.

NB_UGATE

NB section high-side driver output.

Connect to NB section high-side MOSFET gate. A small series resistor may help in

reducing NB_PHASE pin negative spike as well as cooling the device.

NB_PHASE

NB section high-side driver return path.

Connect to the NB section high-side MOSFET source.

This pin is also monitored for the adaptive dead-time management.

BOOT2

CORE section, phase 2 high-side driver supply.

This pin supplies the High-Side floating driver. Connect through CBOOT capacitor to

the PHASE2 pin.

See Section 10 for guidance in designing the capacitor value.

UGATE2

High-side driver output.

Connect to Phase2 high-side MOSFET gate. A small series resistor may help in

reducing PHASE2 pin negative spike as well as cooling the device.

PHASE2

CORE section, phase 2 high-side driver return path. Connect to the Phase2 high-side

MOSFET source.

This pin is also monitored for the adaptive dead-time management.

VCCDRV

Supply voltage for low-side embedded drivers.

Operative voltage is flexible from 5V ±5% to 12 ±15%. Filter with 1

μF MLCC to GND.

Do not connect VCC to any voltage greater than VCCDR.

43 to

NB_LGATE,

LGATE2,

LGATE1

Low-side driver output.

Connect directly to the low-side MOSFET gate of the related section. A small series

resistor can be useful to reduce dissipated power especially in high frequency

applications.

PHASE1

CORE section, phase 1 high-side driver return path. Connect to the phase1 high-side

MOSFET source.

This pin is also monitored for the adaptive dead-time management.

UGATE1

High-side driver output.

Connect to phase1 high-side MOSFET gate. A small series resistor may help in

reducing PHASE1 pin negative spike as well as cooling the device.

BOOT1

CORE section, phase 1 high-side driver supply.

This pin supplies the high-side floating driver. Connect through CBOOT capacitor to the

PHASE1 pin.

See Section 10 for guidance in designing the capacitor value.

Thermal

PAD

GND

All internal references, logic, and the Silicon substrate are referenced to this pin.

Connect to the PCB GND ground plane by multiple vias to improve heat dissipation.

Table 2.

Pin description (continued)

Pin#

Name

Function

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