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STM32F101ZC датащи(PDF) 96 Page - STMicroelectronics

номер детали STM32F101ZC
подробное описание детали  High-density access line, ARM-based 32-bit MCU
PDF  112 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F101ZC датащи(HTML) 96 Page - STMicroelectronics

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Electrical characteristics
STM32F101xC, STM32F101xD, STM32F101xE
96/112
Doc ID 14610 Rev 8
Figure 50.
Typical connection diagram using the ADC
1.
Refer to Table 55 for the values of RAIN, RADC and CADC.
2.
Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 51 or Figure 52,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 51.
Power supply and reference decoupling (VREF+ not connected to VDDA)
1.
VREF+ and VREF- inputs are available only on 100-pin packages.
ai14139d
STM32F10xxx
VDD
AINx
IL±1 µA
0.6 V
VT
RAIN(1)
Cparasitic
VAIN
0.6 V
VT
RADC(1)
CADC(1)
12-bit
converter
Sample and hold ADC
converter
V REF+
STM32F10xxx
V DDA
V SSA/V REF-
1 µF // 10 nF
1 µF // 10 nF
ai14380b



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