MPC8349EVVALDB datasheet(77/87 Pages) FREESCALE

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13

Freescale Semiconductor

Thermal

where:

RθJA = junction-to-ambient thermal resistance (°C/W)

RθJC = junction-to-case thermal resistance (°C/W)

RθCA = case-to-ambient thermal resistance (°C/W)

RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to

change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat

sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit

board, or change the thermal dissipation on the printed-circuit board surrounding the device.

The thermal performance of devices with heat sinks has been simulated with a few commercially available

heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,

adjacent component power dissipation) and the physical space available. Because there is not a standard

application environment, a standard heat sink is not required.

Table 64 shows heat sink thermal resistance for TBGA of the MPC8349EA.

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Table 64. Heat Sink and Thermal Resistance of MPC8349EA (TBGA)

Heat Sink Assuming Thermal Grease

Air Flow

× 35 mm TBGA

Thermal Resistance

AAVID 30

× 30 × 9.4 mm pin fin

Natural convection

AAVID 30

× 30 × 9.4 mm pin fin

1 m/s

6.5

AAVID 30

× 30 × 9.4 mm pin fin

2 m/s

5.6

AAVID 31

× 35 × 23 mm pin fin

Natural convection

8.4

AAVID 31

× 35 × 23 mm pin fin

1 m/s

4.7

AAVID 31

× 35 × 23 mm pin fin

2 m/s

Wakefield, 53

× 53 × 25 mm pin fin

Natural convection

5.7

Wakefield, 53

× 53 × 25 mm pin fin

1 m/s

3.5

Wakefield, 53

× 53 × 25 mm pin fin

2 m/s

2.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

Natural convection

6.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

4.1

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

2.8

MEI, 75

× 85 × 12 mm, adjacent board, 40 mm side bypass

1 m/s

3.1

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