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GD82541PI датащи(PDF) 35 Page - Intel Corporation |
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GD82541PI датащи(HTML) 35 Page - Intel Corporation |
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35 / 46 page ![]() Networking Silicon — 82541(PI/GI/EI) 35 5.2 Thermal Specifications The 82541(PI/GI/EI) device is specified for operation when the ambient temperature (TA) is within the range of 0° C to 70° C. TC (case temperature) is calculated using the equation: TC = TA + P (θJA - θJC) TJ (junction temperature) is calculated using the equation: TJ = TA + P θJA P (power consumption) is calculated by using the typical ICC, as indicated in Table 7 of Section 4.0, and nominal VCC. The preliminary thermal resistances are shown in Table 13. Thermal resistances are determined empirically with test devices mounted on standard thermal test boards. Real system designs may have different characteristics due to board thickness, arrangement of ground planes, and proximity of other components. The case temperature measurements should be used to assure that the 82541(PI/GI/EI) device is operating under recommended conditions. Table 13. Thermal Characteristics Symbol Parameter Preliminary Value at specified airflow (m/s) Units 012 θJA Thermal resistance, junction-to-ambient 29 25.0 23.5 C/Watt θJC Thermal resistance, junction-to-case 11.1 11.1 11.1 C/Watt |
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