GD82541PI datasheet(26/46 Pages) INTEL

26 / 46 page

82541(PI/GI/EI) — Networking Silicon

Cin

Input capacitance

Operating temperature

° C

Aptp

Input clock amplitude (peak-to-peak)

1.0

1.2

1.3

Vcm

Clock common mode

0.6

a. Clock jitter is defined according to the recommendations of part 40.6.1.2.5 IEEE 1000BASE-T Standard (at least

105 clock edges, filtered by HPF with cut off frequency 5000 Hz).

Table 14. Reference Crystal Specification Requirements

Specification

Value

Vibrational Mode

Fundamental

Nominal Frequency

25.000 MHz at 25° C

Frequency Tolerance

•

±30 ppm recommended

•

±30 ppm required for the 82541GI/EI

•

±50 ppm across the entire operating temperature range

(required by IEEE specifications)

Temperature Stability

•

±50 ppm at 0° C to 70° C

•

±30 ppm at 0° C to 70° C (required for the 82541GI/EI)

Calibration Mode

Parallel

Load Capacitance

•

16 pF to 20 pF

•

18 pF (required for the 82541GI/EI)

Shunt Capacitance

6 pF maximum

Equivalent Series Resistance

•

Ω maximum

•

Ω maximum (required for the 82541GI/EI)

Drive Level

0.5 mW maximum

Aging

±5 ppm per year maximum

Table 13. 25 MHz Clock Input Requirements

Symbol

Parameter

Specifications

Units

Min

Typ

Max

Table 15. Link Interface Clock Requirements

Symbol

Parameter

Min

Typ

Max

Unit

fGTXa

GTX_CLK frequency

125

MHz

a. GTX_CLK is used externally for test purposes only.

Table 16. EEPROM Interface Clock Requirements

Symbol

Parameter

Min

Typ

Max

Unit

fSK

Microwire EEPROM Clock

MHz

SPI EEPROM Clock

MHz

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