| поискавой системы для электроныых деталей |
|
MPC8315CVRADDA датащи(PDF) 105 Page - Freescale Semiconductor, Inc |
|
|
|||||||||||||||||||||||||||||
MPC8315CVRADDA датащи(HTML) 105 Page - Freescale Semiconductor, Inc |
|
105 / 106 page ![]() MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 105 Revision History 28 Revision History This table summarizes a revision history for this document. Table 83. Revision History Revision Date Substantive Change(s) 2 11/2011 • In Table 70: – Corrected Note 11 to pull down. – Note 10 added to RESREF pin. Removed all other instances of Note 10. – Added pull up information. 1 11/2011 • Added Notes 4, 5, 6, and 7 in Table 2. •In Table 6: – Decoupled PCI_CLK and SYS_CLK_IN rise and fall times. – Relaxed maximum rise/fall time of SYS_CLK_IN from 1.2 ns to 4 ns. – Modified Note 2. – Updated SYS_CLK_IN/PCI_CLK frequency from 66 MHz to 66.67 MHz. • Added Note 4 to Table 9. • Added a note stating “eTSEC should be interfaced with peripheral operating at same voltage level.” in Section 9.1.1, “MII, RMII, RGMII, and RTBI DC Electrical Characteristics.” • Added a note in Table 26 stating “The frequency of RX_CLK should not exceed the TX_CLK by more than 300 ppm." • Added a note in Table 29 stating “The frequency of RX_CLK should not exceed the GTX_CLK125 by more than 300 ppm •In Table 42, changed min/max values of tCLK_TOL from 0.05 to 0.005. • Added tLALEHOV parameter to Table 44 • Replaced 50 with 50 in Section 16.5, “Receiver Compliance Eye Diagrams.” •In Table 70: – Added Pull up and Pull down information. – Removed Note 2 from TSEC_MDIO. • Removed configuration 2 from Table 77. • Removed Preliminary from Section 25, “Thermal.” • Removed MDIO signal from Section 26.7, “Pull-Up Resistor Requirements” as this signal is not open drain. • Replaced LCCR with LCRR throughout. • Replaced SYS_CLKIN with SYS_CLK_IN throughout. • Replaced all LBIUCM with LBCM. • Replaced all SYS_CR_CLK_IN and SYS_CR_CLK_OUT with SYS_XTAL_IN and SYS_XTAL_OUT, respectively. Replaced all USB_CR_CLK_IN and USB_CR_CLK_OUT with USB_XTAL_IN and USB_XTAL_OUT, respectively. • Added rise/fall time spec for TDM CLK 0 05/2009 Initial public release |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |