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MPC8315CVRADDA датащи(PDF) 102 Page - Freescale Semiconductor, Inc |
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MPC8315CVRADDA датащи(HTML) 102 Page - Freescale Semiconductor, Inc |
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102 / 106 page ![]() MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2 102 Freescale Semiconductor System Design Information Power and ground connections must be made to all external VDD, GVDD, LVDD, NVDD, and GND pins of the device. 26.5 Output Buffer DC Impedance The MPC8315E drivers are characterized over process, voltage, and temperature. For all buses, the driver is a push-pull single-ended driver type (open drain for I2C). To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to NVDD or GND. Then, the value of each resistor is varied until the pad voltage is NVDD/2 (see Figure 64). The output impedance is the average of two components, the resistances of the pull-up and pull-down devices. When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals NVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value. Then, Z0 = (RP + RN)/2. Figure 64. Driver Impedance Measurement The value of this resistance and the strength of the driver’s current source can be found by making two measurements. First, the output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential termination resistor of value Rterm. The measured voltage is V2 =(1/(1/R1 +1/R2)) Isource. Solving for the output impedance gives Rsource = Rterm (V1/V2 – 1). The drive current is then Isource =V1/Rsource. NVDD OGND RP RN Pad Data SW1 SW2 |
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