TFP410-EP

PanelBus

™ DIGITAL TRANSMITTER

SGLS344A − JULY 2006 − REVISED MAY 2011

25

POST OFFICE BOX 655303

PowerPADt 64-pin TQFP package (continued)

Thermal vias or other

connection-to-ground vias

5.9 mm

minimum

Figure 14. Recommended Pad Size

More information on this package and other requirements for using thermal lands and thermal vias are detailed

in the TI application report PowerPADt Thermally-Enhanced Package, TI literature number SLMA002,

available at www.ti.com.

Table 2 shows the thermal properties of the 64-pin TQFP PowerPAD package. The 64-pin TQFP

non-PowerPAD package is included only for reference.

Table 2. 64-Pin TQFP (10 mm × 10 mm × 1 mm)/0,5-mm Lead Pitch

PARAMETER

WITHOUT

PowerPAD

PowerPAD

NOT CONNECTED TO

PCB THERMAL PLANE

PowerPAD

CONNECTED TO PCB

THERMAL PLANE

(see Note 1)

Thermal resistance, junction to ambient

(see Note 1 and Note 2)

75.83°C/W

42.2°C/W

21.47°C/W

Thermal resistance, junction to case

(see Note 1 and Note 2)

7.8°/W

0.38°C/W

0.38°C/W

Power-handling capabilities of package

(see Note 1, Note 2, and Note 3)

0.92 W

1.66 W

3.26 W

NOTES: 1. Specified with the PowerPAD bond pad on the back side of the package soldered to a 2-oz Cu plate PCB thermal plane

2. Airflow is at 0 LFM (no airflow).

3. Specified at 150°C junction temperature and 80°C ambient temperature