ADP1874ARQZ-0.3-R7 datasheet(6/44 Pages) AD

6 / 44 page

ADP1874/ADP1875

Rev. 0 | Page 6 of 44

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VREG, VREG_IN, TRACK to PGND, GND

−0.3 V to +6 V

VIN, EN, PGOOD to PGND

−0.3 V to +28 V

FB, COMP, RES, SS to GND

−0.3 V to (VREG + 0.3 V)

DRVL to PGND

−0.3 V to (VREG + 0.3 V)

SW to PGND

−2.0 V to +28 V

BST to SW

−0.6 V to (VREG + 0.3 V)

BST to PGND

−0.3 V to +28 V

DRVH to SW

−0.3 V to VREG

PGND to GND

±0.3 V

PGOOD Input Current

35 mA

θJA (16-Lead QSOP)

4-Layer Board

104°C/W

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Maximum Soldering Lead Temperature

(10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to PGND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

θJA (16-Lead QSOP)

4-Layer Board

104°

°C/W

BOUNDARY CONDITION

In determining the values given in Table 2 and Table 3, natural

convection is used to transfer heat to a 4-layer evaluation board.

ESD CAUTION

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