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Datasheet

Package Mechanical Specifications

3.2

Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-out zone

requirements. A thermal and mechanical solution design must not intrude into the required keep-

out zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the

package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones.

The location and quantity of package capacitors may change due to manufacturing efficiencies but

will remain within the component keep-in.

3.3

Package Loading Specifications

Table 3-1 provides dynamic and static load specifications for the processor package. These

mechanical maximum load limits should not be exceeded during heatsink assembly, shipping

conditions, or standard use condition. Also, any mechanical system or component testing should

not exceed the maximum limits. The processor package substrate should not be used as a

mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum

loading specification must be maintained by any thermal and mechanical solutions.

Table 3-1. Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

Static

44 N [10 lbf]

445 N [100 lbf]

1,2,3

NOTES:

These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the

minimum specified load on the processor package.

These specifications are based on limited testing for design characterization. Loading limits are for the

package only and does not include the limits of the processor socket.

Dynamic

—

890 N [200 lbf]

1,3,4

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load require-

ment.

Transient

—

667 N [150 lbf]

1,3,5

Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,

representative of loads experienced by the package during heatsink installation.

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