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335 датащи(PDF) 31 Page - Intel Corporation

номер детали 335
подробное описание детали  Celeron D Processor
PDF  82 Pages
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производитель  INTEL [Intel Corporation]
домашняя страница  http://www.intel.com
Logo INTEL - Intel Corporation

335 датащи(HTML) 31 Page - Intel Corporation

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Datasheet
31
Package Mechanical Specifications
3
Package Mechanical
Specifications
The Celeron D processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package that
interfaces with the motherboard via a mPGA478B socket. The package consists of a processor core
mounted on a substrate pin-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions
(such as a heatsink). Figure 3-1 shows a sketch of the processor package components and how they
are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C, and
mPGA476 Socket Design Guidelines for complete details on the mPGA478B socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Pin dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Figure 3-1. Processor Package Assembly Sketch
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM
SOCKET
SUBSTRATE
IHS
CAPACITORS
CORE (DIE)
MOTHERBOARD
TIM



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