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335 датащи(PDF) 31 Page - Intel Corporation |
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335 датащи(HTML) 31 Page - Intel Corporation |
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31 / 82 page ![]() Datasheet 31 Package Mechanical Specifications 3 Package Mechanical Specifications The Celeron D processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package that interfaces with the motherboard via a mPGA478B socket. The package consists of a processor core mounted on a substrate pin-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions (such as a heatsink). Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C, and mPGA476 Socket Design Guidelines for complete details on the mPGA478B socket. The package components shown in Figure 3-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors NOTE: 1. Socket and motherboard are included for reference and are not part of processor package. 3.1 Package Mechanical Drawing The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: • Package reference with tolerances (total height, length, width, etc.) • IHS parallelism and tilt • Pin dimensions • Top-side and back-side component keep-out dimensions • Reference datums All drawing dimensions are in mm [in]. Figure 3-1. Processor Package Assembly Sketch SOCKET SUBSTRATE IHS CAPACITORS CORE (DIE) MOTHERBOARD TIM SOCKET SUBSTRATE IHS CAPACITORS CORE (DIE) MOTHERBOARD TIM |
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