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Datasheet

Boxed Processor Specifications

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the boxed

processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's

temperature specification is also a function of the thermal design of the entire system, and

ultimately the responsibility of the system integrator. The processor temperature specification is

found in Chapter 5 of this document. The boxed processor fan heatsink is able to keep the

processor temperature within the specifications (see Table 5-1) in chassis that provide good

thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the

airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and

out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow

through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the

cooling efficiency and decreases fan life. Figure 7-6 and Figure 7-7 illustrate an acceptable

airspace clearance for the fan heatsink. The air temperature entering the fan is required to be at or

below 38 °C. Again, meeting the processor's temperature specification is the responsibility of the

system integrator.

Figure 7-5. Baseboard Power Header Placement Relative to Processor Socket

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