MPC5604B datasheet(15/72 Pages) FREESCALE

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Electrical characteristics

MPC5604B/C Microcontroller Data Sheet, Rev. 4

Freescale Semiconductor

NOTE

RAM data retention is guaranteed with VDD_LV not below 1.08 V.

4.6

Thermal characteristics

4.6.1

Package thermal characteristics

4.6.2

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:

TJ = TA + (PD x RθJA)

Eqn. 1

Where:

TA is the ambient temperature in °C.

RθJA is the package junction-to-ambient thermal resistance, in °C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

4 470 nF capacitance needs to be provided between V

DD_BV and the nearest VSS_LV (higher value may be needed

depending on external regulator characteristics).

5 100 nF capacitance needs to be provided between V

DD_ADC/VSS_ADC pair.

6 Guaranteed by device validation

Table 9. LQFP thermal characteristics1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions2

2 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C.

count

Value3

3 All values need to be confirmed during device validation.

Unit

Min

Typ

Max

RθJA CC D Thermal resistance,

junction-to-ambient natural

convection4

4 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.

Single-layer board—1s

100

—

°C/W

144

—

Four-layer board—2s2p

100

—

50.8

144

—

49.4

Table 10. 208 MAPBGA thermal characteristics1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RθJA CC — Thermal resistance, junction-to-ambient natural

convection2

2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.

Single-layer board—1s

TBD

°C/W

Four-layer board—2s2p

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