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MPC5604B датащи(PDF) 29 Page - Freescale Semiconductor, Inc |
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MPC5604B датащи(HTML) 29 Page - Freescale Semiconductor, Inc |
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29 / 72 page ![]() Electrical characteristics MPC5604B/C Microcontroller Data Sheet, Rev. 4 Freescale Semiconductor 29 4.11 Flash memory electrical characteristics 4.11.1 Program/Erase characteristics Table 23 shows the program and erase characteristics. IDDSTDBY1 CC T STANDBY1 mode current10 Slow internal RC oscillator (128 kHz) running TA = 25 °C — 20 60 µA D TA = 55 °C — TBD — D TA =85°C — — D TA = 105 °C — — D TA = 125 °C — 280 TBD 1 V DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified 2 Running consumption is given on voltage regulator supply (V DDREG). It does not include consumption linked to I/Os toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with all peripherals running, and code fetched from code flash while modify operation on-going on data flash. It is to be noticed that this value can be significantly reduced by application: switch-off not used peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode when possible. 3 Higher current may be sinked by device during power-up and standby exit. please refer to in rush current on Table 20. 4 RUN current measured with typical application with accesses on both flash and RAM. 5 Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPi as Master, PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic SW/WDG timer reset enabled. 6 Data Flash Power Down. Code Flash in Low Power. RC-osc128kHz & RC-OSC 16MHz on. 10MHz XTAL clock. FlexCAN: instances: 0, 1, 2 ON (clocked but not reception or transmission), instances: 4, 5, 6 clock gated. LINFlex: instances: 0, 1, 2 ON (clocked but not reception or transmission), instance: 3 clock gated. eMIOS: instance: 0 ON (16 channels on PA[0]-PA[11] and PC[12]-PC[15]) with PWM 20KHz, instance: 1 clock gated. DSPI: instance: 0 (clocked but no communication). RTC/API ON.PIT ON. STM ON. ADC ON but not conversion except 2 analogue watchdog 7 Only for the “P” classification: No clock, RC 16MHz off, RC128kHz on, PLL off, HPvreg off, ULPVreg/LPVreg on. All possible peripherals off and clock gated. Flash in power down mode. 8 When going from RUN to STOP mode and the core consumption is > 6 mA , it is normal operation for the main regulator module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction temperatures exceeding 125 °C and under these circumstances , it is possible for the current to initially exceed the maximum STOP specification by up to 2 mA. After entering stop, the application junction temperature will reduce to the ambient level and the main regulator will be automatically switched off when the load current is below 6 mA. 9 Only for the “P” classification: ULPreg on, HP/LPVreg off, 32kB RAM on, device configured for minimum consumption, all possible modules switched-off. 10 ULPreg on, HP/LPVreg off, 8kB RAM on, device configured for minimum consumption, all possible modules switched-off. Table 22. Low voltage power domain electrical characteristics (continued) Symbol C Parameter Conditions1 Value Unit Min Typ Max |
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