MPC5604B datasheet(69/72 Pages) FREESCALE

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Document revision history

MPC5604B/C Microcontroller Data Sheet, Rev. 4

Freescale Semiconductor

06-Mar-2009 Made minor editing and formatting changes to improve readability

Harmonized oscillator naming throughout document

Features:

—Replaced 32 KB with 48 KB as max SRAM size

—Updated descripiton of INTC

—Changed max number of GPIO pins from 121 to 123

Updated Section 1.1, “Introduction

Updated Table 2

Added Section 2, “Device blocks

Section 3, “Package pinouts: Removed signal descriptions (these are found in the device

reference manual)

Updated Figure 2:

—Replaced VPP with VSS_HV on pin 18

—Added MA[1] as AF3 for PC[10] (pin 28)

—Added MA[0] as AF2 for PC[3] (pin 116)

—Changed description for pin 120 to PH[10] / GPIO[122] / TMS

—Changed description for pin 127 to PH[9] / GPIO[121] / TCK

—Replaced NMI[0] with NMI on pin 11

Updated Figure 3:

—Replaced VPP with VSS_HV on pin 14

—Added MA[1] as AF3 for PC[10] (pin 22)

—Added MA[0] as AF2 for PC[3] (pin 77)

—Changed description for pin 81 to PH[10] / GPIO[122] / TMS

—Changed description for pin 88 to PH[9] / GPIO[121] / TCK

—Removed E1UC[19] from pin 76

—Replaced [11] with WKUP[11] for PB[3] (pin 1)

—Replaced NMI[0] with NMI on pin 7

Updated Figure 4:

—Changed description for ball B8 from TCK to PH[9]

—Changed description for ball B9 from TMS to PH[10]

—Updated descriptions for balls R9 and T9

Added Section 3.2, “Parameter classification and tagged parameters in tables where

appropriate

Added Section 3.3, “NVUSRO register

Updated Table 7

Section 3.5, “Recommended operating conditions: Added note on RAM data retention to

end of section

Updated Table 8 and Table 9

Added Section 3.6.1, “Package thermal characteristics

Updated Section 3.6.2, “Power considerations

Updated Figure 6

Updated Table 12, Table 13, Table 14, Table 15 and Table 16

Table 45. Revision history (continued)

Revision

Date

Description of Changes

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