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MCP631 датащи(PDF) 19 Page - Microchip Technology |
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MCP631 датащи(HTML) 19 Page - Microchip Technology |
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19 / 42 page ![]() © 2009 Microchip Technology Inc. DS22197A-page 19 MCP631/2/3/5 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 3.1 Analog Outputs The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Analog Inputs The non-inverting and inverting inputs (VIN+, VIN–, …) are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins The positive power supply (VDD) is 2.5V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.4 Chip Select Digital Input (CS) This input (CS) is a CMOS, Schmitt-triggered input that places the part into a low power mode of operation. 3.5 Exposed Thermal Pad (EP) There is an internal connection between the Exposed Thermal Pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance ( θJA). MCP631 MCP632 MCP633 MCP635 Symbol Description SOIC SOIC DFN SOIC MSOP DFN 61 1 6 1 1 VOUT, VOUTA Output (op amp A) 22 2 2 2 2 VIN–, VINA– Inverting Input (op amp A) 33 3 3 3 3 VIN+, VINA+ Non-inverting Input (op amp A) 44 4 4 4 4 VSS Negative Power Supply —— — 8 5 5 CS, CSA Chip Select Digital Input (op amp A) —— — — 6 6 CSB Chip Select Digital Input (op amp B) —5 5 — 7 7 VINB+ Non-inverting Input (op amp B) —6 6 — 8 8 VINB– Inverting Input (op amp B) —7 7 — 9 9 VOUTB Output (op amp B) 7 8 8 7 10 10 VDD Positive Power Supply 1,5,8 — — 1,5 — — NC No Internal Connection — — 9 — — 11 EP Exposed Thermal Pad (EP); must be connected to VSS |
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