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MCP631 датащи(PDF) 29 Page - Microchip Technology |
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MCP631 датащи(HTML) 29 Page - Microchip Technology |
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29 / 42 page ![]() © 2009 Microchip Technology Inc. DS22197A-page 29 MCP631/2/3/5 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-Lead SOIC (150 mil) (MCP631, MCP632, MCP633) Example : XXXXXXXX XXXXYYWW NNN MCP631E SN 0931 256 3 e 8-Lead DFN (3×3) (MCP632) Example Device Code MCP632 DABM Note: Applies to 8-Lead 3x3 DFN 10-Lead MSOP (MCP635) Example : 635EUN 931256 XXXXXX YWWNNN 10-Lead DFN (3×3) (MCP635) Example Device Code MCP635 BAFB Note: Applies to 10-Lead 3x3 DFN XXXX YYWW NNN DABM 0931 256 XXXX YYWW NNN BAFB 0931 256 |
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