ST72334J2TASLASHXXX datasheet(149/150 Pages) STMICROELECTRONICS

149 / 150 page

ST72334xx-Auto, ST72314xx-Auto, ST72124Jx-Auto

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19 SUMMARY OF CHANGES

Description of the changes between the current release of the specification and the previous one.

Date

Revision

Main changes

17-Oct-2007

Initial release of the ST72334xx-Auto,ST72314xx-Auto, ST72124Jx-Auto datasheet

This datasheet was created from the ST72334J/N, ST72314J/N, ST72124J datasheet, revision

2.5 dated April 2003, with the following changes:

Changed document title and description on page 1

Removed PSDIP package outlines from page 1

“Device Summary” on page 1:

- modified to include only automotive devices

- replaced ‘ROM’ with ‘Flash/ROM’ as program memory for ST72124J2-Auto device

- added operating temperature range specific to ROM devices

Section 1 "PREAMBLE: ST72C334-Auto VERSUS ST72E331 SPECIFICATION" on page 7:

Replaced ST72C334 with ST72C334-Auto

Section 2 "INTRODUCTION" on page 8: Added -Auto extension to ST72xxxJ/N numbers

Section 3 "PIN DESCRIPTION" on page 9: Removed Figure "56-Pin SDIP Package Pinout"

Figure 3.44-Pin TQFP Package Pinout (J versions): Removed SDIP package pinout

Table 1, “Device Pin Description,” on page 11: Removed SDIP device pin number columns

Section 8 "SUPPLY, RESET AND CLOCK MANAGEMENT" on page 26: Added -Auto exten-

sion to ST72xxxJ/N numbers in first paragraph

Modified description of external and internal RC in “MULTI-OSCILLATOR (MO)” on page 30

Section 13.1.3 "Functional Description" on page 50: Replaced 500ns with 30µs at end of sec-

ond paragraph to be in line with spec given in Section 15.9.1 "Asynchronous RESET Pin" on

page 132

Section 14.1.4 "Indexed (No Offset, Short, Long)" on page 103: Replaced “The indirect ad-

dressing mode” with “The indexed addressing mode” in second paragraph

Section 15.3.1 "General Operating Conditions" on page 111: Modified ambient temperature

range conditions to include only automotive device suffix versions

Figure 95.SPI Slave Timing Diagram with CPHA = 1 1): Replaced CPHA=0 with CPHA=1 for

SCK INPUT

Section 16.1 "PACKAGE MECHANICAL DATA" on page 141:

- removed Figure “56-Pin Plastic Dual In-Line Package, Shrink 600-mil Width”

- removed Figure “42-Pin Plastic Dual In-Line Package, Shrink 600-mil Width”

- added Section 16.3 "ECOPACK®" on page 142

- removed Section "SOLDERING AND GLUEABILITY INFORMATION"

Section 16.2 "THERMAL CHARACTERISTICS" on page 142: Removed SDIP packages and

associated values from package thermal resistance ratings

Section 17.2.1 "User Option Byte 0" on page 143: Replaced 56/42-pin package configurations

with 64/44-pin package configurations

Figure 101.ROM Factory Coded Device Types: Modified to include only automotive devices

Figure 102.Flash User Programmable Device Types:

- modified to include only automotive devices

- removed B temperature version

“MICROCONTROLLER OPTION LIST” on page 145: Removed SDIP devices

Section 17.4 "DEVELOPMENT TOOLS" on page 146: Replaced ‘http//mcu.st.com’ with

‘www.st.com” at end of first paragraph

Table 27, “STMicroelectronics Tool Features,” on page 146:

- changed programming capability from ‘Yes (all packages)’ to ‘Yes’ for ST7 Programming

Board

- added footnote 2

Section 17.5 "ST7 APPLICATION NOTES" on page 147: Removed Table “ST7 Application

Notes”

Updated disclaimer on last page to include a mention about the use of ST products in automo-

tive applications

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