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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ST72334J2TA/XXX датащи(PDF) 142 Page - STMicroelectronics |
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ST72334J2TA/XXX датащи(HTML) 142 Page - STMicroelectronics |
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142 / 150 page  ST72334xx-Auto, ST72314xx-Auto, ST72124Jx-Auto 142/150 PACKAGE CHARACTERISTICS (Cont’d) 16.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. 16.3 ECOPACK® In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level in- terconnect. The category of second level intercon- nect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK® spec- ifications are available at www.st.com. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TQFP64 TQFP44 60 52 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C |
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