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CHR71000 датащи(PDF) 51 Page - ams-OSRAM AG |
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CHR71000 датащи(HTML) 51 Page - ams-OSRAM AG |
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51 / 54 page ![]() CHR71000 Soldering & storage information Datasheet • PUBLIC • Document Feedback DS000427 • v2-01 • 2026-Mar-18 51 / 54 / 11 Soldering & storage information Image sensors with filter arrays (CFA) and micro-lens are especially sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the performance of the sensor. Best solution will be flow soldering or manual soldering of a socket (through hole or BGA) and plug in the sensor at latest stage of the assembly/test process. The BGA solution allows more flexibility for the routing of the camera PCB. 11.1 Manual soldering Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350°C with 270°C maximum pin temperature, 2 seconds maximum duration per pin. Avoid global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability. 11.2 Wave soldering Wave soldering is possible but not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. See the figure below for the wave soldering profile. Figure 29: Wave solder profile |
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