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RA4M2 датащи(PDF) 32 Page - Renesas Technology Corp

номер детали RA4M2
подробное описание детали  RA4M2 Group
PDF  93 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RA4M2 датащи(HTML) 32 Page - Renesas Technology Corp

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Table 2.12
Power consumption of each unit
Dynamic current/
Leakage current
MCU
Domain
Category
Item
Frequency
[MHz]
Current
[uA/MHz]
Current*1
[mA]
Leakage current
Analog
LDO and Leak*2
Ta = 75 °C*3
—
—
7.82
Ta = 85 °C*3
—
—
9.13
Ta = 95 °C*3
—
—
11.08
Ta = 105 °C*3
—
—
14.33
Dynamic current
CPU
Operation with
Flash and SRAM
Coremark
100
55.556
5.56
Peripheral Unit
Timer
GPT16 (4ch)*4
100
3.575
0.36
GPT32 (4ch)*4
100
4.230
0.42
POEG (4 Groups)
50
1.361
0.07
AGT (6ch)*4
50
9.228
0.46
RTC
50
4.277
0.21
WDT
50
0.764
0.04
IWDT
50
0.339
0.02
Communication
interfaces
USBFS
50
9.385
0.47
SCI (6ch)*4
100
18.715
1.87
IIC (2ch)*4
50
3.367
0.16
CAN
50
1.898
0.09
SPI
100
3.024
0.30
QSPI
100
2.051
0.21
SSIE
50
3.208
0.16
SDHI
50
6.341
0.32
Analog
ADC12
100
2.287
0.23
DAC12 (2ch)*4
100
0.869
0.09
TSN
50
0.166
0.01
Human machine
interfaces
CTSU
50
0.605
0.03
Event link
ELC
50
0.865
0.04
Security
SCE9
100
218.100
21.81
Data processing
CRC
100
0.600
0.06
DOC
100
0.388
0.04
System
CAC
50
0.844
0.04
DMA
DMAC
100
4.479
0.45
DTC
100
4.274
0.43
Note 1. The values are guaranteed by design.
Note 2. LDO and Leak are internal voltage regulator’s current and MCU’s leakage current.
It is selected according to the temperature of Ta.
Note 3. Δ(Tj-Ta) = 20 °C is considered to measure the current.
Note 4. To determine the current consumption per channel, group or unit, divide Current [mA] by the number of channels, groups or units.
Table 2.13 shows the outline of operation for each unit.
RA4M2 Datasheet
2. Electrical Characteristics
R01DS0367EJ0140 Rev.1.40
May 9, 2025
Page 32 of 93



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