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RA4M2 датащи(PDF) 31 Page - Renesas Technology Corp |
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RA4M2 датащи(HTML) 31 Page - Renesas Technology Corp |
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31 / 93 page ![]() Vr(VCC) VCC 1 / fr(VCC) Figure 2.6 Ripple waveform 2.2.7 Thermal Characteristics Maximum value of junction temperature (Tj) must not exceed the value of “section 2.2.1. Tj/Ta Definition”. Tj is calculated by either of the following equations. ● Tj = Ta + θja × Total power consumption ● Tj = Tt + Ψjt × Total power consumption – Tj : Junction Temperature (°C) – Ta : Ambient Temperature (°C) – Tt : Top Center Case Temperature (°C) – θja : Thermal Resistance of “Junction”-to-“Ambient” (°C/W) – Ψjt : Thermal Resistance of “Junction”-to-“Top Center Case” (°C/W) ● Total power consumption = Voltage × (Leakage current + Dynamic current) ● Leakage current of IO = Σ (IOL × VOL) /Voltage + Σ (|IOH| × |VCC – VOH|) /Voltage ● Dynamic current of IO = Σ IO (Cin + Cload) × IO switching frequency × Voltage – Cin: Input capacitance – Cload: Output capacitance Regarding θja and Ψjt, refer to Table 2.11. Table 2.11 Thermal Resistance Parameter Package Symbol Value*1 Unit Test conditions Thermal Resistance 48-pin QFN (PWQN0048KC-A) θja 23.9 °C/W JESD 51-2 and 51-7 compliant 48-pin LQFP (PLQP0048KB-B) 62.1 64-pin LQFP (PLQP0064KB-C) 54.6 100-pin LQFP (PLQP0100KB-B) 55.1 48-pin QFN (PWQN0048KC-A) Ψjt 0.28 °C/W JESD 51-2 and 51-7 compliant 48-pin LQFP (PLQP0048KB-B) 2.39 64-pin LQFP (PLQP0064KB-C) 1.90 100-pin LQFP (PLQP0100KB-B) 1.90 Note 1. The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of the board. For details, refer to the JEDEC standards. 2.2.7.1 Calculation guide of ICCmax Table 2.12 shows the power consumption of each unit. RA4M2 Datasheet 2. Electrical Characteristics R01DS0367EJ0140 Rev.1.40 May 9, 2025 Page 31 of 93 |
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