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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TMP512 датащи(PDF) 56 Page - Texas Instruments |
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TMP512 датащи(HTML) 56 Page - Texas Instruments |
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56 / 62 page  www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 16X (0.31) 16X (0.6) ( 0.2) TYP VIA 12X (0.65) (3.8) (3.8) (1.1) ( 2.7) (R0.05) TYP (1.1) VQFN - 1 mm max height RSA0016B PLASTIC QUAD FLATPACK - NO LEAD 4219093/A 08/2021 SYMM 1 4 5 8 9 12 13 16 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:18X 17 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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