ADS9217 datasheet(6/68 Pages) TI2

6 / 68 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD_1V8 to GND

–0.3

2.1

AVDD_5V to GND

–0.3

5.5

AINP and AINM to GND

–0.3

AVDD_5V + 0.3

REFIO to REFM

REFM – 0.3

AVDD_5V + 0.3

Digital inputs to GND

–0.3

VDD_1V8 + 0.3

REFM to GND

–0.3

0.3

Input current to any pin except supply pins(2)

–10

Junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Pin current must be limited to 10mA or less.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, analog input pins AINP and

AINM(1)

±2000

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all other pins(1)

±1000

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1)

ADS911x

UNIT

RHA (VQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

25.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

13.3

°C/W

RθJB

Junction-to-board thermal resistance

7.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.1

°C/W

ΨJB

Junction-to-board characterization parameter

7.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

ADS9117, ADS9118, ADS9119

SLVSIN3 – MAY 2025

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Product Folder Links: ADS9117 ADS9118 ADS9119

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