ADIS16501SLASHPCBZ datasheet(42/45 Pages) AD

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Data Sheet

ADIS16501

APPLICATIONS INFORMATION

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Rev. B | 42 of 45

ASSEMBLY AND HANDLING TIPS

Package Attributes

The ADIS16501 is a multichip module package that has a 100-ball

BGA interface. This package has three basic attributes that influ-

ence its handling and assembly to the PCB of the system: the

lid, the substrate, and the BGA pattern. The material of the lid is

a liquid crystal polymer (LCP), and its nominal thickness is 0.5

mm. The substrate is a laminate that has a nominal thickness of

1.57 mm. The solder ball material is SAC305, and each ball has a

nominal diameter of 0.75 mm (±0.15 mm). The BGA pattern is a 10

× 10 array.

All electrical and physical connections are through the 10 × 10 array

shown in Figure 62. The bottom view in #unique_8/unique_8_Con-

nect_42_F66 shows additional features from the manufacture of

the ADIS16501 that are not relevant to the mounting or use of the

ADIS16501.

Assembly Tips

When attaching the ADIS16501 to a PCB, follow these guidelines:

►

The ADIS16501 supports solder reflow attachment processes in

accordance with J-STD-020E.

►

Limit device exposure to one pass through the solder reflow

process (no rework).

►

The hole in the top of the lid (see Figure 61) provides vent-

ing and pressure relief during the assembly process of the

ADIS16501. This hole must be kept clear while attaching the

ADIS16501 to a PCB. However, covering the hole in normal

operation is not typically a problem.

Figure 61. Pressure Relief Hole

►

Use no clean flux and avoid exposing the device to cleaning

solvents that can penetrate the inside of the ADIS16501 through

multiple paths.

►

Manage moisture exposure prior to the solder reflow processing

in accordance with J-STD-033, Moisture Sensitivity Level 5.

►

Avoid exposing the ADIS16501 to mechanical shock survivability

that exceeds the maximum rating in Table 3. In standard PCB

processing, high speed handling equipment and panel separa-

tion processes often present the most risk of introducing harmful

levels of mechanical shock survivability.

PCB Layout Suggestions

Figure 62 shows an example of the pad design and layout for the

ADIS16501 on a PCB. This example uses a solder mask opening

with a diameter of 0.73 mm, around a metal pad that has a

diameter of 0.56 mm. When using a material for the system PCB

that has similar thermal expansion properties as the substrate

material of the ADIS16501, the system PCB can also use the solder

mask to define the pads that support attachment to the balls of

the ADIS16501. The coefficient of thermal expansion (CTE) in the

substrate of the ADIS16501 is approximately 14 ppm/°C.

Figure 62. Recommended PCB Pattern, Solder Mask Defined Pads

Underfill

Underfill can be a useful technique in managing certain threats

to the integrity of the solder joints of the ADIS16501, including

peeling stress and extended exposure to vibration. When selecting

underfill material and developing an application and curing process,

ensure that the material fills the gap between each surface (the

ADIS16501 substrate and system PCB) and adheres to both surfa-

ces. The ADIS16501 does not require the use of underfill materials

in applications that do not anticipate exposure to these types of

mechanical stresses and when the CTE of the system PCB is close

to the same value as the CTE of the substrate of the ADIS16501

(~14 ppm/°C).

Process Validation and Control

These guidelines provide a starting point for developing a process

for attaching the ADIS16501 to a system PCB. Because each

system and situation can present unique requirements for this at-

tachment process, ensure that the process supports optimal solder

joint integrity, verify that the final system meets all environmental

test requirements, and establish observation and control strategies

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