USB3250 datasheet(12/48 Pages) SMSC

12 / 48 page

USB2.0 PHY IC

Datasheet

Revision 1.5 (03-24-06)

SMSC GT3200, SMSC USB3250

DATASHEET

Note 4.1

A Ferrite Bead (with DC resistance <.5 Ohms) is recommended for filtering between both

the VDD3.3 and VDDA3.3 supplies and the VDD1.8 and VDDA1.8 Supplies. See

Figure 8.9 Application Diagram for 64-pin TQFP Package on page 45.

Note 4.2

56-pin QFN package will down-bond all VSS and VSSA to exposed pad under IC.

Exposed pad must be connected to solid GND plane on printed circuit board.

Table 4.3 USB I/O Signals

NAME

DIRECTION

ACTIVE

LEVEL

DESCRIPTION

I/O

N/A

USB Positive Data Pin.

I/O

N/A

USB Negative Data Pin.

Table 4.4 Biasing and Clock Oscillator Signals

NAME

DIRECTION

ACTIVE

LEVEL

DESCRIPTION

RBIAS

Input

N/A

External 1% bias resistor. Requires a 12K

Ω resistor to ground.

Used for setting HS transmit current level and on-chip termination

impedance.

XI/XO

Input

N/A

External crystal. 12MHz crystal connected from XI to XO.

Table 4.5 Power and Ground Signals

NAME

DIRECTION

ACTIVE

LEVEL

DESCRIPTION

VDD3.3

N/A

3.3V Digital Supply. Powers digital pads. See Note 4.1

VDD1.8

N/A

1.8V Digital Supply. Powers digital core.

VSS

N/A

Digital Ground. See Note 4.2

VDDA3.3

N/A

3.3V Analog Supply. Powers analog I/O and 3.3V analog

circuitry.

VDDA1.8

N/A

1.8V Analog Supply. Powers 1.8V analog circuitry. See Note 4.1

VSSA

N/A

Analog Ground. See Note 4.2

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