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VL53L8CH датащи(PDF) 37 Page - STMicroelectronics |
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VL53L8CH датащи(HTML) 37 Page - STMicroelectronics |
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37 / 44 page ![]() Figure 36. Solder profile Note: The component should be limited to a maximum of three passes through this solder profile. Note: As the VL53L8CH package is not sealed, only a dry reflow process should be used (such as convection reflow). Vapor phase reflow is not suitable for this type of optical component. Note: The VL53L8CH is an optical component and as such, it should be treated carefully. This typically includes using a ‘no-wash’ assembly process. 11.6 Handling and storage precautions 11.6.1 Recommended solder pad dimensions Figure 37. Recommended solder pattern VL53L8CH Handling and storage precautions DS14310 - Rev 3 page 37/44 |
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