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VL53L8CH датащи(PDF) 36 Page - STMicroelectronics

номер детали VL53L8CH
подробное описание детали  Artificial intelligence enabler, high performance 8x8 multizone Time-of-Flight (ToF) sensor
PDF  44 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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VL53L8CH датащи(HTML) 36 Page - STMicroelectronics

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11.4
Tape outline drawing
Figure 35. VL53L8CH tape and reel packaging drawing
11.5
Pb-free solder reflow process
Table 25. Recommended solder profile and Figure 36. Solder profile show the recommended and maximum
values for the solder profile.
Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect
customers to follow the “recommended” reflow profile, which is specifically tuned for the VL53L8CH package.
For any reason, if a customer must perform a reflow profile, which is different from the “recommended” one
(especially where the peak temperature is > 240°C), the new profile must be qualified by the customer at their
own risk. The profile has to be within the “maximum” profile limit described in Table 25. Recommended solder
profile.
Table 25. Recommended solder profile
Parameters
Recommended
Maximum
Units
Minimum temperature (TS min)
Maximum temperature (TS max)
Time ts (TS min to TS max)
130
200
90-110
150
200
60-120
°C
°C
s
Temperature (TL)
Time (tL)
Ramp up
217
55-65
2
217
55-65
3
°C
s
°C/s
Temperature (Tp-10)
Time (tp-10)
Ramp up
—
—
—
235
10
3
°C
s
°C/s
Peak temperature (Tp)
240
260
°C
Time to peak
300
300
s
Ramp down (peak to TL)
-4
-6
°C/s
VL53L8CH
Tape outline drawing
DS14310 - Rev 3
page 36/44



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