Symbol

Parameter

Condition

Min

Typ

Max

Unit

Pin

FLT

-

-

-0.3

-

40

V

-

STBY_IN

-

-

-0.3

-

5

V

-

STBY_ECHO

-

-

-0.3

-

3.6

V

-

OV

-

-

-0.3

-

40

V

-

UV

-

-

-0.3

-

40

V

-

3.3

ESD data

Table 5. ESD data

Symbol

Parameter

Test Condition

Min

Typ

Max

Unit

Notes

HBM_ ESD

HBM(1)

All pins(2)

-2

-

2

kV

Class 2

CDM _ESD

CDM(1)

All pins

-500

-

500

V

Class C3

CDM_COR_ESD

CDM(1)

Corner pins

-750

-

750

V

Class C4

LUT

Latch up(3)

All pins

-100

-

100

mA

-

1. According to AEC-Q100-011.

2. Pins are all GND connected.

3. According to AEC-Q100-004.

3.4

Temperature range and thermal data

Table 6. Temperature range and thermal data

Symbol

Parameter

Test condition Min Typ Max Unit

Notes

Tamb

Operating temperature (ECU

environment)

-

-40

-

125

°C

-

Tj(1)

Operating junction temperature

-

-40

-

150

°C

-

Tj

Extended operating junction

temperature

-

-40

-

175

°C

12000 h over life time

Tsto

Storage temperature

-

-55

-

150

°C

RthJ-A(2) Thermal resistance junction-to-ambient

-

-

35

-

°C/W

Homogeneous internal power

distribution(3)

Rth j-cb(2)

Thermal resistance junction-to-case-

bottom

-

-

4

-

°C/W

Homogeneous internal power

distribution

1. All parameters are guaranteed, and tested, in the temperature range -40 ≤ Tj ≤ 150 °C unless otherwise specified. The

device is still operative and functional at higher temperatures (up to Tj 175 °C). Device functionality at high temperature is

guaranteed by bench validation, electrical parameters are guaranteed by correlation with ATE tests at reduced temperature

and adjusted limits (if needed).

2. Not subject to production test, guaranteed by design.

3. RthJ-A value is retrieved according to Jedec JESD51-2, -5, -7 guideline with a 2s2p board.

STPM801

ESD data

DS13990 - Rev 2

page 8/38